Description
The EAI-V330 series is engineered as a cost-effective embedded system, incorporating the Intel® Elkhart Lake Extended Temp CPU. This configuration delivers high-quality performance while maintaining low power consumption, making it ideal for in-vehicle computing applications. Additionally, this product boasts AI acceleration capabilities, with support for features such as the HAILO-8 M.2 2242 M key socket. It is versatile enough to be employed in various applications, including general control system monitoring and physical security systems, among others.
Specifications
| Processor System | |
| CPU | Intel® Atom™ x6425E/x6413E/x6211E Processors, 12W/9W/6W (codename: Elkhart Lake-I) |
| Frequency | 2.0 GHz/1.5 GHz/1.3 GHz |
| Core Number | Quad-core |
| BIOS | AMI SPI Flash BIOS |
| Chipset | SoC |
| Processor Graphics | Intel® UHD Graphics |
| Fanless | |
| Yes | |
| Memory | |
| Technology | 1x SODIMM DDR4/x 3200MT/s |
| Max. Capacity | Up to 32GB (Default 16G/8G/4G by SKU) |
| Socket | 1x 260pin SODIMM |
| Ethernet | |
| Controller | Intel® i210IS |
| Interface | 6x RJ45, 1x OOB Port (By SKU) |
| PoE | 4x IEEE 802.3af PoE Ports/ 2x at PoE+ Ports (Under Max. 60W Power Budget) |
| Audio | |
| Controller | 92HD73E1 |
| Interface | 1x Mic-in & 1x Line-out |
| Storage | |
| Type | SATA |
| Installation | 1x SATA (removable 2.5” storage bay) |
| Type | eMMC |
| Installation | Onboard eMMC 128GB |
| I/O | |
| Display | 2x HDMI with screw lock |
| LAN | 7x RJ45 Ports (2x GbE LAN w/ i210IT, 4x PoE+ w/ 1x i210IS, 1x OOB by SKU) |
| CAN | 1x CAN 2.0 |
| COM | 2x RS-232/422/485 |
| USB | 3x USB 2.0 Type A, 1x USB 3.0 Type A |
| GNSS/G-sensor | u-blox NEO-M9N/ ADXL 345 |
| Digital I/O | 12V, 4x DI (support PNP/NPN/dry contact) & 24V, 2x DO (support dry/ sink), 1x IGN_DI to MCU |
| Antenna | 5x SMA antenna hole (includes GNSS) |
| Expansion | |
| M.2 | 1x M.2 304(5)2 B Key socket (USB 3.0/ PCIe x1) for 4G LTE/ 5G sub6, (In/Out-of-Band Management by SKU) 1x M.2 2230 E key Socket for Wi-Fi |
| Cooling | |
| Processor | Passive CPU heatsink |
| System | Fanless design with corrugated aluminum |
| Environment | |
| Operating Temperature | -40~70°C / -40~158°F |
| Storage Temperature | -40~85°C / -40~185°F |
| Relative Humidity | 5%~90% Operating; 5%~95% Non-Operating |
| Miscellaneous | |
| Hardware Monitoring | Yes |
| Internal RTC with Li Battery | Yes |
| Mechanical | |
| Dimension (W x D x H) | 273.8 x 98 x 185 mm |
| Weight | 4.5 kg |
| Mounting | wall mount kit |
| Power | |
| Connector | 3-pin terminal block (+,-,ignition) |
| Input | Supports DC 12~48V |
| Driver Support | |
| Microsoft Windows | Windows 10/11 IoT |
| Linux | Kernel 2.6.X or later, Ubuntu 20.04 or later, Debian 10 |
| Certification | |
| EMC | FCC/CE Class A, UKCA, E13, RoHS |
| Certified | UL/cUL (UL-62368-1) & CB (DC 24V~60V only), MIL-STD-810G |
| RoHS | RoHS 3 |
Order Information
| EAI-V330A | Intel Atom® x6425E 4C/4T 2.0GHz 12W, LPDDR4/x 3200MT/s 16GB (up to 16GB), In/Out-of-Band Management Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0/PCIe x1) for 4G LTE/ 5G sub6 with dual SIM socket reserved. |
| EAI-V330B | Intel Atom® x6413E 4C/4T 1.5GHz 9W, LPDDR4/x 3200MT/s 8GB (up to 16GB) Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0) for 4G LTE/ 5G sub6 with dual SIM socket reserved. |
| EAI-V330C | Intel Atom® x6211E 2C/2T 1.3GHz 6W LPDDR4/x 3200MT/s 4GB (up to 16GB) Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0) for 4G LTE/ 5G sub6 with dual SIM socket reserved. |
| EAI-V330H | Intel Atom® x6425E 4C/4T 2.0GHz 12W, LPDDR4/x 3200MT/s 16GB (up to 16GB), In/Out-of-Band Management Default “PCIe x1” for M.2 304(5)2 B Key socket x1. |
| PGN-300 | 4G LTE Radio Modem with LTE Cat-6 embedded module, certified with PTCRB, AT&T, Verizon |
| PGN-600 | 4G LTE-Advanced Pro Radio Modem with LTE Cat-12 embedded module, certified with PTCRB, AT&T |
| PGN-750B | Swappable 5G Quectel RM500Q-AE module with antenna/cable kit |
| CAN Bus | CAN Bus 77MT36478 |
All product specifications are subject to change without prior notice
