Description
The EAI-V330 series is engineered as a cost-effective embedded system, incorporating the Intel® Elkhart Lake Extended Temp CPU. This configuration delivers high-quality performance while maintaining low power consumption, making it ideal for in-vehicle computing applications. Additionally, this product boasts AI acceleration capabilities, with support for features such as the HAILO-8 M.2 2242 M key socket. It is versatile enough to be employed in various applications, including general control system monitoring and physical security systems, among others.
Specifications
Processor System | |
CPU | Intel® Atom™ x6425E/x6413E/x6211E Processors, 12W/9W/6W (codename: Elkhart Lake-I) |
Frequency | 2.0 GHz/1.5 GHz/1.3 GHz |
Core Number | Quad-core |
BIOS | AMI SPI Flash BIOS |
Chipset | SoC |
Processor Graphics | Intel® UHD Graphics |
Fanless | |
Yes | |
Memory | |
Technology | 1x SODIMM DDR4/x 3200MT/s |
Max. Capacity | Up to 32GB (Default 16G/8G/4G by SKU) |
Socket | 1x 260pin SODIMM |
Ethernet | |
Controller | Intel® i210IS |
Interface | 6x RJ45, 1x OOB Port (By SKU) |
PoE | 4x IEEE 802.3af PoE Ports/ 2x at PoE+ Ports (Under Max. 60W Power Budget) |
Audio | |
Controller | 92HD73E1 |
Interface | 1x Mic-in & 1x Line-out |
Storage | |
Type | SATA |
Installation | 1x SATA (removable 2.5” storage bay) |
Type | eMMC |
Installation | Onboard eMMC 128GB |
I/O | |
Display | 2x HDMI with screw lock |
LAN | 7x RJ45 Ports (2x GbE LAN w/ i210IT, 4x PoE+ w/ 1x i210IS, 1x OOB by SKU) |
CAN | 1x CAN 2.0 |
COM | 2x RS-232/422/485 |
USB | 3x USB 2.0 Type A, 1x USB 3.0 Type A |
GNSS/G-sensor | u-blox NEO-M9N/ ADXL 345 |
Digital I/O | 12V, 4x DI (support PNP/NPN/dry contact) & 24V, 2x DO (support dry/ sink), 1x IGN_DI to MCU |
Antenna | 5x SMA antenna hole (includes GNSS) |
Expansion | |
M.2 | 1x M.2 304(5)2 B Key socket (USB 3.0/ PCIe x1) for 4G LTE/ 5G sub6, (In/Out-of-Band Management by SKU) 1x M.2 2230 E key Socket for Wi-Fi |
Cooling | |
Processor | Passive CPU heatsink |
System | Fanless design with corrugated aluminum |
Environment | |
Operating Temperature | -40~70°C / -40~158°F |
Storage Temperature | -40~85°C / -40~185°F |
Relative Humidity | 5%~90% Operating; 5%~95% Non-Operating |
Miscellaneous | |
Hardware Monitoring | Yes |
Internal RTC with Li Battery | Yes |
Mechanical | |
Dimension (W x D x H) | 273.8 x 98 x 185 mm |
Weight | 4.5 kg |
Mounting | wall mount kit |
Power | |
Connector | 3-pin terminal block (+,-,ignition) |
Input | Supports DC 12~48V |
Driver Support | |
Microsoft Windows | Windows 10/11 IoT |
Linux | Kernel 2.6.X or later, Ubuntu 20.04 or later, Debian 10 |
Certification | |
EMC | FCC/CE Class A, UKCA, E13, RoHS |
Certified | UL/cUL (UL-62368-1) & CB (DC 24V~60V only), MIL-STD-810G |
RoHS | RoHS 3 |
Order Information
EAI-V330A | Intel Atom® x6425E 4C/4T 2.0GHz 12W, LPDDR4/x 3200MT/s 16GB (up to 16GB), In/Out-of-Band Management Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0/PCIe x1) for 4G LTE/ 5G sub6 with dual SIM socket reserved. |
EAI-V330B | Intel Atom® x6413E 4C/4T 1.5GHz 9W, LPDDR4/x 3200MT/s 8GB (up to 16GB) Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0) for 4G LTE/ 5G sub6 with dual SIM socket reserved. |
EAI-V330C | Intel Atom® x6211E 2C/2T 1.3GHz 6W LPDDR4/x 3200MT/s 4GB (up to 16GB) Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0) for 4G LTE/ 5G sub6 with dual SIM socket reserved. |
EAI-V330H | Intel Atom® x6425E 4C/4T 2.0GHz 12W, LPDDR4/x 3200MT/s 16GB (up to 16GB), In/Out-of-Band Management Default “PCIe x1” for M.2 304(5)2 B Key socket x1. |
PGN-300 | 4G LTE Radio Modem with LTE Cat-6 embedded module, certified with PTCRB, AT&T, Verizon |
PGN-600 | 4G LTE-Advanced Pro Radio Modem with LTE Cat-12 embedded module, certified with PTCRB, AT&T |
PGN-750B | Swappable 5G Quectel RM500Q-AE module with antenna/cable kit |
CAN Bus | CAN Bus 77MT36478 |
All product specifications are subject to change without prior notice