EAI-V330

Fanless In-vehicle AI Inference System with Intel® Elkhart Lake Processor Intel® Atom™ X6000 Series Processor (codename: Elkhart Lake-I) 1x SODIMM DDR4, Up to 32GB eMMC 128GB, 1x SATA 1x PGN Series Removable Caddy, 1x M.2 304(5)2 B Key socket (USB 3.0/PCIe x1) for 4G LTE/ 5G sub6, 1x M.2 2230 E key socket for Wi-Fi 7x RJ45 ports (2x GbE LAN w/I210IT, 4x PoE+w/1x i210IS, 1x OOB (by SKU) 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0  Datasheet  User Manual

Description

The EAI-V330 series is engineered as a cost-effective embedded system, incorporating the Intel® Elkhart Lake Extended Temp CPU. This configuration delivers high-quality performance while maintaining low power consumption, making it ideal for in-vehicle computing applications. Additionally, this product boasts AI acceleration capabilities, with support for features such as the HAILO-8 M.2 2242 M key socket. It is versatile enough to be employed in various applications, including general control system monitoring and physical security systems, among others.

Specifications

Processor System
CPU Intel® Atom™ x6425E/x6413E/x6211E Processors, 12W/9W/6W (codename: Elkhart Lake-I)
Frequency 2.0 GHz/1.5 GHz/1.3 GHz
Core Number Quad-core
BIOS AMI SPI Flash BIOS
Chipset SoC
Processor Graphics Intel® UHD Graphics
Fanless
Yes
Memory
Technology 1x SODIMM DDR4/x 3200MT/s
Max. Capacity Up to 32GB (Default 16G/8G/4G by SKU)
Socket 1x 260pin SODIMM
Ethernet
Controller Intel® i210IS
Interface 6x RJ45, 1x OOB Port (By SKU)
PoE 4x IEEE 802.3af PoE Ports/ 2x at PoE+ Ports (Under Max. 60W Power Budget)
Audio
Controller 92HD73E1
Interface 1x Mic-in & 1x Line-out
Storage
Type SATA
Installation 1x SATA (removable 2.5” storage bay)
Type eMMC
Installation Onboard eMMC 128GB
I/O
Display 2x HDMI with screw lock
LAN 7x RJ45 Ports (2x GbE LAN w/ i210IT, 4x PoE+ w/ 1x i210IS, 1x OOB by SKU)
CAN 1x CAN 2.0
COM 2x RS-232/422/485
USB 3x USB 2.0 Type A, 1x USB 3.0 Type A
GNSS/G-sensor u-blox NEO-M9N/ ADXL 345
Digital I/O 12V, 4x DI (support PNP/NPN/dry contact) & 24V, 2x DO (support dry/ sink), 1x IGN_DI to MCU
Antenna 5x SMA antenna hole (includes GNSS)
Expansion
M.2 1x M.2 304(5)2 B Key socket (USB 3.0/ PCIe x1) for 4G LTE/ 5G sub6, (In/Out-of-Band Management by SKU) 1x M.2 2230 E key Socket for Wi-Fi
Cooling
Processor Passive CPU heatsink
System Fanless design with corrugated aluminum
Environment
Operating Temperature -40~70°C / -40~158°F
Storage Temperature -40~85°C / -40~185°F
Relative Humidity 5%~90% Operating; 5%~95% Non-Operating
Miscellaneous
Hardware Monitoring Yes
Internal RTC with Li Battery Yes
Mechanical
Dimension (W x D x H) 273.8 x 98 x 185 mm
Weight 4.5 kg
Mounting wall mount kit
Power
Connector 3-pin terminal block (+,-,ignition)
Input Supports DC 12~48V
Driver Support
Microsoft Windows Windows 10/11 IoT
Linux Kernel 2.6.X or later, Ubuntu 20.04 or later, Debian 10
Certification
EMC FCC/CE Class A, UKCA, E13, RoHS
Certified UL/cUL (UL-62368-1) & CB (DC 24V~60V only), MIL-STD-810G
RoHS RoHS 3

Order Information

EAI-V330A Intel Atom® x6425E 4C/4T 2.0GHz 12W, LPDDR4/x 3200MT/s 16GB (up to 16GB), In/Out-of-Band Management Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0/PCIe x1) for 4G LTE/ 5G sub6 with dual SIM socket reserved.
EAI-V330B Intel Atom® x6413E 4C/4T 1.5GHz 9W, LPDDR4/x 3200MT/s 8GB (up to 16GB) Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0) for 4G LTE/ 5G sub6 with dual SIM socket reserved.
EAI-V330C Intel Atom® x6211E 2C/2T 1.3GHz 6W LPDDR4/x 3200MT/s 4GB (up to 16GB) Default “USB 3.0” for M.2 304(5)2 B Key socket x1 (USB 3.0) for 4G LTE/ 5G sub6 with dual SIM socket reserved.
EAI-V330H Intel Atom® x6425E 4C/4T 2.0GHz 12W, LPDDR4/x 3200MT/s 16GB (up to 16GB), In/Out-of-Band Management Default “PCIe x1” for M.2 304(5)2 B Key socket x1.
PGN-300 4G LTE Radio Modem with LTE Cat-6 embedded module, certified with PTCRB, AT&T, Verizon
PGN-600 4G LTE-Advanced Pro Radio Modem with LTE Cat-12 embedded module, certified with PTCRB, AT&T
PGN-750B Swappable 5G Quectel RM500Q-AE module with antenna/cable kit
CAN Bus CAN Bus 77MT36478

All product specifications are subject to change without prior notice